3D-printed Ion Trap

Description:

1. Technology Overview 

The invention introduces a 3D-printed ion trap designed for quantum computing applications. This innovative device leverages additive 3D printing of glass structures to create ion traps that can be integrated onto wafers containing micro-fabricated elements. The technology offers significant potential for improving trapping efficiency, depth, and harmonicity compared to traditional 2D surface-electrode traps. Currently in the development stage, this technology holds strong potential for commercialization in quantum computing, semiconductor manufacturing, and related fields. 

2. Key Features and Benefits 

  • Additive Manufacturing: Simplifies fabrication and allows integration with micro-fabricated components. 

  • Enhanced Trapping Properties: Improved efficiency, depth, and harmonicity compared to 2D traps. 

  • Scalability: Established 3D printing techniques enable large-scale production. 

  • Versatility: Applicable to a wide range of quantum computing and advanced manufacturing applications. 

  • Integration: Compatible with existing micro-fabrication processes and semiconductor technologies. 

3. Applications and Market Focus 

  • Quantum Computing: Enhancing the performance and scalability of quantum computing systems. 

  • Semiconductor Manufacturing: Providing advanced fabrication methods for semiconductor devices. 

  • MEMS: Supporting the development of micro-electromechanical systems with improved properties. 

  • Photonics and Optoelectronics: Enabling advanced applications in photonics and optoelectronics. 

  • Research and Development: Facilitating further innovation in quantum computing and advanced manufacturing technologies. 

4. Commercial Advantages 

  • Strategic Benefits: Offers a scalable and efficient solution for ion trap fabrication in quantum computing. 

  • Implementation Advantages: Simplifies the development of high-performance ion traps and related devices. 

  • Market Positioning: Positions the technology as a key enabler in quantum computing and advanced manufacturing sectors. 

  • Competitive Edge: Provides a unique and effective method for improving trapping properties and fabrication efficiency. 

5. Partnership Opportunities 

  • Licensing Partners: Ideal for companies in quantum computing, semiconductor manufacturing, and MEMS. 

  • Cross-Sector Benefits: Offers advantages to multiple industries, including photonics and optoelectronics. 

  • Market Opportunities: Addresses diverse market needs, from quantum computing to advanced manufacturing. 

  • Collaborative Development: Potential for joint ventures with research institutions and technology firms to further enhance the technology. 

Patent Information:
For Information, Contact:
Christine Gramer
Associate Director
University of Oregon
cgramer@uoregon.edu
Inventors:
David Allcock
Tim Gardner
Morgan Brown
Alexander Quinn
Keywords: